The COM Express® Compact Module TQMxE40C1, powered by 6th Generation Intel Atom® x6000 series processors, delivers impressive CPU computing power with dual/quad-core capabilities clocking up to 3.0 GHz. It boasts up to 16 GB of soldered LPDDR4/4x memory, with optional inband ECC, ensuring reliable and efficient performance. Featuring a compact design (95 mm x 95 mm) and low power dissipation (4.5 - 12 Watt TDP), this module is ideal for various applications, including industrial automation, measurement technology, aviation, and medical technology, even in extreme temperatures ranging from -40°C to +85°C.

The TQMxE40C1 offers exceptional connectivity with two USB 3.1 Gen 2 ports (2x 10 Gbit/s) and, for the first time, 8 PCIe Gen 3 lanes (8 GT/s), facilitating high-speed data transfer and expansions on the carrier board. It supports up to three parallel displays with up to 4K screen resolution, thanks to the latest Intel graphics processor.

Virtualization capabilities and features like Time Coordinated Computing make it suitable for real-time applications and time-synchronized IoT solutions. Additional flexibility is provided through optional eMMC flash memory (up to 256 GByte) and a choice between embedded DisplayPort (eDP) or LVDS assembly options. The integrated board controller ensures thermal management, includes a multi-stage watchdog, and supports "Green ECO-Off" for minimal standby power consumption. With optional conformal coating and optimized cooling solutions, the TQMxE40C1 is well-suited for rugged environments.

Featuring a wide range of CPU processors, memory options, and connectivity interfaces, this COM Express module is a versatile solution for FPGA engineers seeking reliable and high-performance embedded computing solutions.