TQMx110EB COM Express® Basic Type 6 Module

11th Generation Intel® Core™ and Intel® Xeon® W-11000E Series Processors

 

The TQMx110EB is an embedded module that ushers in a new era of computing and graphics performance. Powered by 11th Generation Intel® Core™ and Intel® Xeon® W-11000E series processors, this module delivers a high-end computing experience in a compact form factor. With up to 8 cores and 16 threads, turbo speeds of up to 4.7 GHz, and a generous 24 MB cache, it offers formidable processing power for a wide range of applications.

 

One standout feature is the exceptional graphics performance driven by Intel® Iris® Xe graphics, capable of handling 8K high-resolution outputs. This makes it ideal for tasks involving gaming, machine vision, virtual reality, medical technology, and industrial automation.

 

Efficiency is a key focus, thanks to the energy-efficient 10nm manufacturing process and a power-efficient design with TDP options ranging from 25W to 45W. Additionally, the module supports AI and image processing tasks with the inclusion of the vector neural networks instruction set (VNNI).

 

The TQMx110EB also boasts impressive expandability with 16 PCIe Gen 4 lanes directly from the CPU and support for up to 64 GB of high-speed DDR4-3200 memory, ensuring robust system performance and ample room for expansion. High-speed peripheral and network interfaces, including USB 3.2 Gen2 and 2.5 Gigabit Ethernet, further enhance its versatility.

 

In summary, the TQMx110EB is a versatile embedded module that combines cutting-edge processing power, graphics capabilities, and energy efficiency, making it a compelling choice for FPGA engineers tackling demanding applications.

Features

  • High-Performance Processors: 11th Generation Intel® Core™ and Intel® Xeon® W-11000E series processors, offering up to 8 cores and 16 threads

  • Outstanding Graphics: Features Intel® Iris® Xe graphics with support for 8K high-resolution output, making it suitable for applications demanding advanced visual processing and display capabilities.

  • Memory and Expansion: Supports up to 64 GB of high-speed DDR4-3200 memory and provides 16 PCIe Gen 4 lanes directly from the CPU

  • Efficiency: 10nm manufacturing technology and various TDP options (25W, 35W, and 45W), a balance between performance and power consumption for FPGA applications.

  • AI and Image Processing: Vector neural networks instruction set (VNNI) to enhance AI and image processing capabilities

Specifications

CPU
  • Intel® Core™ i7-11850HE (8-Core, 2.6/4.7 GHz, 24 MB, 32 EU, 35/45 W TDP)
  • Intel® Core™ i5-11500HE (6-Core, 2.6/4.5 GHz, 12 MB, 32 EU, 35/45 W TDP)
  • Intel® Core™ i3-11100HE (4-Core, 2.4/4.4 GHz, 8 MB, 16 EU, 35/45 W TDP)
  • Intel® Xeon® W-11865MRE (8-Core, 2.6/4.7 GHz, 24 MB, 32 EU, ECC, 24/7, RT, eTEMP, 35/45 W TDP)
  • Intel® Xeon® W-11555MRE (6-Core, 2.6/4.5 GHz, 12 MB, 32 EU, ECC, 24/7, RT, eTEMP, 35/45 W TDP)
  • Intel® Xeon® W-11155MRE (4-Core, 2.4/4.4 GHz, 8 MB, 16 EU, ECC, 24/7, RT, eTEMP, 35/45 W TDP)
  • Intel® Xeon® W-11865MLE (8-Core, 1.5/4.5 GHz, 24 MB, 32 EU, ECC, 24/7, RT, 25 W TDP)
  • Intel® Xeon® W-11555MLE (6-Core, 1.9/4.4 GHz, 12 MB, 32 EU, ECC, 24/7, RT, 25 W TDP)
  • Intel® Xeon® W-11155MLE (4-Core, 1.8/3.1 GHz, 8 MB, 16 EU, ECC, 24/7, RT, 25 W TDP)
Memory
  • DDR5-5200 - 64 GB (2 SO-DIMMs)
  • EEPROM - 32kbit
  • M.2 - Onboard soldered NVMe SSD (PCIe Gen3 x4) up to 1 Tbyte (option)
Graphics
  • Up to 4 independant displays: 3x Digital Display Interface / DP++ with up to 8K; DisplayPort 1.4a with support for Multi-Stream Transport (MST); 1x Embedded Digital Display Interface (eDP) or dual channel LVDS interface (eDP 1.4b or dual channel LVDS)
Communications Interfaces
  • Ethernet - 2.5 Gigabit Ethernet (Intel i226)
  • USB - 4x USB 3.2 Gen2 (up to 10 Gb/s) with USB 3.0 compatibility
Other Interfaces
  • PCIe - CIe Gen4 (up to 16 Gb/s per Lane) (1x16, 2x8 or 2x4+1x8)
  • SATA - 4x SATA Gen3 (up to 6 Gb/s)
  • LPC - LPC/eSPI
  • I2C
  • SMBus
  • SPI - SPI (for external UEFI BIOS flash)
  • UART - 2x UART (Rx/Tx) (4-wire optional)
  • GPIO - 8x GPIO through TQ-flexiCFG
General
  • Dimensions - 125 mm x 95 mm
  • Plug-in System - COM Express Compact, type 6
  • Temperature range - Standard temperature: 0°C…+60°C (HE versions)
  • Power supply - 14.5 V...20 V, 5 V Standby (optional), 3 V Battery for RTC
  • Power consumption - typ. 30...50 W / max. 200 W (preliminary)
OS
  • Windows 10 / Windows 10 IoT Enterprise
  • Windows 11 (restricted support)
  • Linux

Ordering Information

TQMx110EB-AA

  • Intel® Core™ i7-11800H, no onboard SSD, TPM 2.0

TQMx110EB-AB

  • Intel® Core™ i5-11400H, no onboard SSD, no TPM

TQMx110EB-AC

IIntel® Core™ i3-11100HE (4-Core, 2.4/4.4 GHz, 8 MB, 16 EU, 35/45 W TDP), HM570E, no onboard SSD, TPM 2.0, C-Temp

TQMx110EB-AD

Intel® Xeon® W-11865MRE (8-Core, 2.6/4.7 GHz, 24 MB, 32 EU, ECC, 24/7, RT, eTEMP, 35/45 W TDP), RM590E, DDR4-ECC-Support, no onboard SSD, TPM 2.0, industrial use conditions with I-Temp

TQMx110EB-AE

Intel® Xeon® W-11555MRE (6-Core, 2.6/4.5 GHz, 12 MB, 32 EU, ECC, 24/7, RT, eTEMP, 35/45 W TDP), RM590E, DDR4-ECC-Support, no onboard SSD, TPM 2.0, industrial use conditions I-Temp

TQMx110EB-AF

Intel® Xeon® W-11155MRE (4-Core, 2.4/4.4 GHz, 8 MB, 16 EU, ECC, 24/7, RT, eTEMP, 35/45 W TDP), RM590E, DDR4-ECC-Support, no onboard SSD, TPM 2.0, industrial use conditions I-Temp

TQMx110EB-AG

Intel® Xeon® W-11865MLE (8-Core, 1.5/4.5 GHz, 24 MB, 32 EU, ECC, 24/7, RT, 25 W TDP), RM590E, DDR4-ECC-Support, no onboard SSD, TPM 2.0, industrial use conditions C-Temp

TQMx110EB-AH

Intel® Xeon® W-11555MLE (6-Core, 1.9/4.4 GHz, 12 MB, 32 EU, ECC, 24/7, RT, 25 W TDP),  RM590E,DDR4-ECC-Support, no onboard SSD, TPM 2.0, industrial use conditions C-Temp

TQMx110EB-AI

Intel® Xeon® W-11155MLE (4-Core, 1.8/3.1 GHz, 8 MB, 16 EU, ECC, 24/7, RT, 25 W TDP), RM590E, DDR4-ECC-Support, no onboard SSD, TPM 2.0, industrial use conditions C-Temp

TQ Embedded is known for:

  • Precision German engineering, now with a North America presence
    • Robust industrial products with support
  • Widest portfolio of embedded processing architectures: ARM, x86, PowerPC 
  • Comprehensive in-house process and facilities for true long-life availability
  • Modules with full signal availability (ALL signals available, not just selective groups)
  • In-house full control: design, manufacturing, specialized adaptations
  • Robust baseboard options, production-ready for mounting their SOM products