IEI TANK-XM810

iEi’s latest TANK system brings Smart Transportation to the forefront with compact, powerful, versatile, and rugged design features

iEi’s latest TANK system brings Smart Transportation to the forefront with compact, powerful, versatile, and rugged design features

 

Smart Transportation just got smarter. iEi has carefully designed their latest Tank series controller to be powerful and versatile yet rugged and fanless with 24/7/365 reliability. Processing is handled by 10th gen highly capable Intel® Core™ processors (i3, i5, i7). Shock and vibration meet military standards. Given the wide operating range of temperature and voltage along with the rich I/O and expansion, various impressive solutions can be implemented.  Given all this, a system based on the iEi TANK-XM810 can monitor and control several system aspects while also implementing and monitoring recognition via multiple cameras. 

The eBus example solution shown below is just one of many examples.

 

Rich I/O

  • Digital I/O (6 in, 6 out)
  • 6 serial ports (RS-232/422/485)
  • 2x 2.5Gb Ethernet ports
  • USB ports (2x 2.0, 6x 3.2 Gen 2)
  • 2 video ports: HDMI and DP++

I/O Expansion Slot

  • 8x 2.5 GbE ports    -or-
  • Multiple M.2 and PCIe slots for wireless, video capture or accelerator card options

There’s also a choice of processors for power: 35W or 65W.

Fanless TANK-XM810

 

The TANK-XM810's thermal design is optimized for better heat conduction using a pin-fin heatsink concept. This enhances two dimensional heat conduction and reduces flow impedance for better heat dissipation in this fan-less system. The overall weight and dimensions are thus reduced, significantly enhancing system reliability in vibration-sensitive applications, such as AGV. Moreover, this innovative thermal design allows the TANK-XM810 to maximize superior performance than those with traditional heatsink consisting of parallel fins.

Wireless TANK-XM810

iEi TANK-XM810 Fanless Embedded PC enables seamless wireless connectivity for remote and mobile edge deployments. Wi-Fi 6 and Bluetooth 5.0 reliably connect to sensors for indoor applications. Dual SIM sockets provide continuous LTE cellular connectivity and network redundancy to ensure uninterrupted data transmission for outdoor mobile edge deployments. Furthermore, the TANK-XM810 is 5G ready through a 5G add-on card and the on-board SIM slot, providing greater cellular speeds.

eBus Solution

Dimensions

Specifications

Form factor
SBC Form Factor
  •  CPU:
    10/11 th Gen Intel® Core™ CPU 35/65W
    Intel® Core™ i3-10320 3.8 GHz (up to 4.6 GHz, quad-core, 65W TDP)
    Intel® Core™ i5-10500TE 2.3 GHz (up to 3.7 GHz, 6-core, 35W TDP)
    Intel® Core™ i7-10700TE 2.0 GHz (up to 4.4 GHz, 8-core, 35W TDP)
  •  Chipset:
    Q470/Q470E
  •  System Memory:
    2 x SO-DIMM DDR4 2933 MHz (up to 64GB)
  •  Power:
    DC Jack: 12 V~28 V DC
    Terminal Block: 12 V~28 V DC
    Consumption: 12V @ 8A (Intel ® Core™ i9-10900TE with 8GB memory)
I/O Interface
I/O Ports
  •  USB:
    6 x USB 3.2 Gen 2
    2 x USB 2.0
  •  Ethernet:
    2 x RJ-45:
    2 x 2.5 GbE by Intel® I225V (colay I225LM)
  •  COM Port:
    2 x RS-232/422/485
    4 x RS-232
  •  Digital I/O:
    12-bit Digital I/O (6-in/ 6-out)
  •  Display:
    1 x HDMI
    1 x DP++
  •  TPM:
    Support Intel PTT
  •  Watchdog Timer:
    Programmable 1 ~ 255 sec/min
Expansion Slots
Expansion SlotsM.2: 2 x 2280 M-key (PCle x2)
Backplane: Optional
System
Cooling method / System FanFanless
4-pin external system fan connector
Drive Bays1 x 2.5” SATA 6Gb/s HDD/SSD bay
Indicator&Buttons
Buttons1 x Power button
1 x Reset button
1 x AT/ATX switch
Indicators1 x Power LED (green)
1 x HDD LED (yellow)
Physical Characteristics
ConstructionExtruded aluminum alloy
Color
ColorBlack
Dimensions
Dimensions230.6 x 256.04 x 76.2
Weight
Weight3.2/3.5 kg
Environment
Operating Temperature-20°C ~ 60°C with air flow (CPU TDP35W & SSD)
-20°C ~ 50°C with air flow (CPU TDP65W & SSD)
Humidity10% ~ 95% non-condensing
Operating VibrationHalf-sine wave shock 5G, 11ms, 100 shocks per axis (SSD)
Operating ShockMIL-STD-810G 514.6C-1 (SSD)
Safety & EMCCE/FCC compliant
OS Support
OS SupportMicrosoft Windows 10 / Windows 11, Linux

Ordering Information

TANK-XM810-i7AC-R10Ruggedized Fanless Embedded System with Intel® i7-10700TE 2.0GHz, (up to 4.4GHz, 8-core, TDP 35W), 8GB DDR4 pre-installed memory, 1xHDMI, 1xDP++, 14~28V DC and RoHS
TANK-XM810-i5AC-R10Ruggedized Fanless Embedded System with Intel® i5-10500TE 2.3GHz, (up to 3.7GHz, 6-core, TDP 35W), 8GB DDR4 pre-installed memory, 1xHDMI, 1xDP++, 14~28V DC and RoHS
TANK-XM810-i3BC-R10Ruggedized Fanless Embedded System with Intel® i3-10320 3.8GHz,(up to 4.6GHz, 4-core, TDP 65W), 8GB DDR4 pre-installed memory, 1xHDMI, 1xDP++,12~28V DC and RoHS

Package Contents

Package Content

  • 1 x Wall mounting kit

  • 1 x Screw pack

  • 2 x Terminal block

Ask us about other iEi Smart Transporation solutions, including Rail and Marine.

 

iEi is known for:

 

Industrial and Medical computing products and instruments, embedded boards and systems, as well as AI processing solutions.  With several award-winning solutions, iEi has demonstrated leadership in the market.  They have alliances with Intel, Microsoft, and Amazon for their leading-edge technology.

Customized solutions are also available, including electrical/digital modifications, mechanical structures and housing, software options, etc.