Starterkit STKxE39M

Based on TQMxE39M Intel Atom® x5/x7 E3900 Apollo Lake-I

 

The Embedded Starterkit STKxE39M is an evaluation kit designed for embedded computing engineers. It is built upon the TQMxE39M platform, featuring Intel Atom® x5/x7 E3900 processors (Apollo Lake-I). This kit offers high-speed connectivity through Gigabit Ethernet, robust design with protective coating options, and support for triple displays with DP/HDMI (up to 4K UHD) and eDP/LVDS interfaces. Equipped with dual/quad-core processors, capable of speeds up to 2.5 GHz, the TQ module is designed for real-time computing, industrial automation, surveillance, aviation, medical, and retail applications. It follows the COM Express® Mini standard and offers 8 USB ports, including 2x USB 3.0, and up to 4 PCIe lanes natively supported by the processor.

Features

  • High-Speed Gigabit Ethernet: Facilitates efficient and high-speed network communication.
  • Robust Design: Designed for rugged applications with protective coating options.
  • Triple Display Support: Allows up to three displays with DP/HDMI (4K UHD) and eDP/LVDS interfaces.
  • Dual/Quad-Core Processors: Equipped with processors capable of speeds up to 2.5 GHz for diverse computing tasks.
  • Flexible Connectivity: Features 8 USB ports, including 2x USB 3.0, and up to 4 PCIe lanes for high-bandwidth communication.

Specifications

CPU
  • Intel Atom® x5/x7 E3900 (Apollo Lake-I)
  • x5-E3930 2x 1.3/1.8 GHz, 6.5 W
  • x5-E3940 4x 1.6/1.8 GHz, 9.5 W
  • x7-E3950 4x 1.6/2.0 GHz, 12 W
  • Celeron® N3350 2x 1.1/2.4 GHz, 6 W
  • Pentium® N4200 4x 1.1/2,5 GHz, 6 W
Memory
  • DDR3L - non-ECC, Dual Channel
  • EEPROM - 32kbit
  • eMMC - 4-64 GB
Graphics
  • 1x Digital Display Interface (DDI) for DP 1.2a, eDP 1.3, HDMI 1.4b
  • 1x eDP1.4/Single Channel LVDS (also usable for second external monitor)
Communications Interfaces
  • Ethernet - 1x Gbit Ethernet 
  • USB - 2x USB 3.0 | 6x USB 2.0
  • Serial Ports: 2x Serial port
Other Interfaces
  • PCIe - 4x PCIe 2.0
  • LPC - LPC/eSPI
  • I2C
  • SMBus
  • SPI - SPI (for external UEFI BIOS flash)
  • Audio - Intel HD Audio
  • GPIO - 8x GPIO through TQ-flexiCFG
  • SD Card - 1x SD Card interface
General
  • Dimensions - 84mm x 55mm
  • Plug-in System - COM Express Mini, type 10
  • Temperature range - Standard temperature: 0°C…+60°C (HE versions)
  • Power supply - Voltage: 4.75 V - 20 V / 4.75 V - 20 V Standby (optional) / 3 V Battery for RTC
  • Power consumption - typ. 3 - 8 W/max. 14 W (Green ECO-Off: < 0.1 W)

 

Ordering Information

TQMxE39M-AA

  • Intel Atom® x7-E3950 (4x 1.6/2.0GHz, 2MB Cache, 12 W TDP), 4GB DDR3L, 32 GB eMMC, eDP,
    Industrial-Temp. -40..+85°C

TQMxE39M-AB

  • Intel Atom® x5-E3940 (4x 1.6/1.8GHz, 2MB Cache, 9.5 W TDP), 4GB DDR3L, 16 GB eMMC, LVDS,
    Industrial-Temp. -40..+85°C

TQMxE39M-AC

  • Intel Atom® x5-E3930 (2x 1.3/1.8GHz, 2MB Cache, 6.5 W TDP), 2GB DDR3L, eDP, Standard-Temp. 0..+60°C

TQMxE39M-AD

  • Intel® Celeron® N3350 (2x 1.1/2.4GHz, 2MB Cache, 6 W TDP), 2GB DDR3L, eDP, Standard-Temp. 0..+60°C

TQMxE39M-AF

  • Intel® Pentium® N4200 (4x 1.1/2.5GHz, 2MB Cache, 6 W TDP), 4GB DDR3L, LVDS, Standard-Temp. 0..+60°C

MB-COME10-1

  • Mainboard for COM Express™ Minimodules, Type 10 Interfaces: DP, eDP/LVDS, 2x Gb Ethernet, 4x USB, 3x COM, audio, mini PCIe, mSATA, 2.5“ SSD, SD card, riser extension with PCIe and USB, fan, debug, 170 mm x 170 mm

TQ Embedded is known for:

  • Precision German engineering, now with a North America presence
    • Robust industrial products with support
  • Widest portfolio of embedded processing architectures: ARM, x86, PowerPC 
  • Comprehensive in-house process and facilities for true long-life availability
  • Modules with full signal availability (ALL signals available, not just selective groups)
  • In-house full control: design, manufacturing, specialized adaptations
  • Robust baseboard options, production-ready for mounting their SOM products