Starterkit STKx60EB

based on TQMx60EB Intel® Core™ (6th Generation) 6000E series Skylake-H

 

The Embedded Starterkit STKx60EB is a specialized evaluation kit designed for embedded computing engineers. It is built on the TQMx60EB platform and powered by the Intel® Core™ (6th Generation) 6000E series („Skylake-H”) processor. This kit is engineered for high-end computing and graphics capabilities, offering features such as large bandwidth with up to 24 PCIe lanes, ECC memory support of up to 32 GB dual channel DDR4, and a customer-specific TQMx86 board controller with expansion options. With its robust design and "Green ECO-Off" standby mode, this kit ensures the highest functional reliability, making it suitable for 24/7 certified applications in the medical, gaming, and industrial fields.

Features

  • Customizable Expansion: Comes with a TQMx86 board controller for customer-specific expansion options (flexiCFG).
  • High-Bandwidth Connectivity: Offers large bandwidth with up to 24 PCIe lanes for efficient data transfer.
  • ECC Memory Support: Supports up to 32 GB dual-channel DDR4 ECC memory for data integrity.
  • Low Standby Consumption: Features "Green ECO-Off" mode to minimize standby power usage.
  • 6th Generation Processing Power: Powered by 6th Generation Intel® Core™ and Intel® Xeon® E3-15xx v5 processors, ensuring high-performance computing.

Specifications

CPU
  • Intel® Xeon® E3-1500 v5 series (Skylake-H)
  • Xeon E3-1505M v5 (4x 2.8/3.7 GHz, 8 MB, GT2, 45/35 W)
  • Xeon E3-1505L v5 (4x 2.0/2.8 GHz, 8 MB, GT2, 25 W)
  • Intel® Core™ 6000E series (Skylake-H)
  • Core i7-6822EQ (4x 2.0/2.8 GHz, 8 MB, GT2, 25 W)
  • Core i7-6820EQ (4x 2.8/3.5 GHz, 8 MB, GT2, 45/35 W)
  • Core i5-6440EQ (4x 2.7/3.4 GHz, 6 MB, GT2, 45/35 W)
  • Core i5-6442EQ (4x 1.9/2.7 GHz, 6 MB, GT2, 25 W)
  • Core i3-6100E (2x 2.7 GHz, 3 MB, GT2, 35 W)
  • Core i3-6102E (2x 1.9 GHz, 3 MB, GT2, 25 W)
Memory
  • DDR4 = 32GB
  • EEPROM - 32kbit
Graphics
  • 3x Digital Display Interface/DP++ with up to 4K @ 60 Hz for DP 1.2a/HDMI 1.4 with multi stream transport (MST)
  • LVDS Interface (18/24-bit, Single/Dual Channel) (optional eDP 1.3 with 4 lanes instead of LVDS)
  • Intel® Quick Sync Video and Wireless Display support
Communications Interfaces
  • Ethernet - 1x Gbit Ethernet
  • USB - 4x USB 3.0 | 8x USB 2.0
  • Serial Ports - 2x Serial Port
Other Interfaces
  • PCIe - 1x PEG Port with PCIe x16 Gen 3 | 8x PCIe Gen 3
  • LPC - LPC bus
  • I2C
  • SMBus
  • SPI - SPI (for external UEFI BIOS flash)
  • Audio - Intel HD Audio
  • GPIO - 8x GPIO through TQ-flexiCFG
  • SATA = 4x STAT Gen 3
General
  • Dimensions - 125mm x 95mm
  • Plug-in System - COM Express Compact, Type 6
  • Temperature range - Standard temperature: 0°C…+60°C (HE versions)
  • Power supply - 8.5 ... 20 V, 5 V Standby (optional), 3 V Battery for RTC
  • Power consumption - Power: typ. 25-30 W/max. 60 W (Green ECO-Off: < 0.1 W)

 

Ordering Information

TQMx60EB-AA

  • Intel® Core™ i7-6822EQ (4x 2.0 / 2.8 GHz, 8 MB, GT2, 25 W), CM236, LVDS, TPM, Standard Temp 0..+60°C

TQMx60EB-AB

  • Intel® Core™ i5-6442EQ (4x 1.9 / 2.7 GHz, 6 MB, GT2, 25 W), CM236, LVDS, TPM, Standard Temp 0..+60°C

TQMx60EB-AC

  • Intel® Core™ i3-6102E (2x 1.9 GHz, 3 MB, GT2, 25 W), CM236, LVDS, ECC Option, Standard Temp 0..+60°C

TQMx60EB-AD

  • Intel® Celeron® G3902E (2x 1.6 GHz, 2 MB, GT1, 25 W), HM170, LVDS, Standard Temp 0..+60°C

TQMx60EB-AE

  • Intel® Celeron® G3900E (2x 2.4 GHz, 2 MB, GT1, 35 W), HM170, LVDS, Standard Temp 0..+60°C

TQMx60EB-AF

  • Intel® Xeon® E3-1515M v5 (4x 2.8 / 3.7 GHz, 8 MB, GT4e, 45 / 35 W), CM236, LVDS, TPM, ECC Option, Standard Temp 0..+60°C

TQMx60EB-AG

  • Intel® Xeon® E3-1505L v5 (4x 2.0 / 2.8 GHz, 8 MB, GT2, 25 W), CM236, LVDS, TPM, ECC Option, Standard Temp 0..+60°C

TQ Embedded is known for:

  • Precision German engineering, now with a North America presence
    • Robust industrial products with support
  • Widest portfolio of embedded processing architectures: ARM, x86, PowerPC 
  • Comprehensive in-house process and facilities for true long-life availability
  • Modules with full signal availability (ALL signals available, not just selective groups)
  • In-house full control: design, manufacturing, specialized adaptations
  • Robust baseboard options, production-ready for mounting their SOM products