Reflex CES Ares Agilex 7 SoM

Ares Agilex™ 7 FPGA SoC F-Series Module

The Ares SoM is an Agilex™ SoC F-Series system-on-module based on the Intel® Agilex™ 7 FPGA SoC F-Series FPGA. It offers flexibility and high-performance capabilities, allowing designers to implement complex algorithms and integrate multiple functions onto a single chip. This results in reduced power consumption, improved system performance, and advanced technology.

 

The Ares SoM is optimized for embedded applications and is delivered with an active heatsink, heat spreader, and fan. Using a module for an embedded system simplifies the design process, and time-to-market is reduced as pre-built and tested components can be easily integrated.

Target markets for the Agilex™ SoC F-Series module include Bioscience, High Precision Measurement, Radar Systems, and more. It is designed to cater to these industries' specific needs and requirements.

Benefits & Features:

  • Intel® Agilex™ 7 FPGA SoC F-Series
  • AGF012
  • PCIe Gen4 x4 Root Complex
  • PCIe Gen4 x16 End Point
  • Quad-Core ARM Cortex A-53
  • 84x LVDS + 140 GPIOs
  • 32 transceivers @32Gbps NRZ OR up to 24 transceivers @58Gbps PAM4
  • Industrial Temp Grade
  • Long Term Supply
  • Designed for Bioscience, High Precision Measurement, Radar Systems, Electronic Warfare, and "Customizable" markets

The module is equipped with Intel® Agilex™ 7 SoC F-Series FPGA technology, which is a general-purpose FPGA built on Intel's 10 nm SuperFin process. The FPGA offers high-capacity logic and memory storage, providing programmable logic and accelerator technologies to improve system performance while reducing power consumption. It can be programmed using embedded programming languages such as VHDL or Verilog and integrated into the system design using industry-standard interfaces like PCI Express (PCIe).

 

The SoC (system-on-chip) integrated within the FPGA provides further flexibility and integration, allowing the FPGA to better control the board. Reflex CES has incorporated essential components such as PCB, transceivers, power supply, JTAG, DDR4, Flash eMMC memory, and BMC (Baseboard Management Controller) for an embedded board designed specifically for the Intel Agilex FPGA.

 

Embedded programming plays a crucial role in developing embedded systems. Reflex CES designers carefully consider the FPGA chip's architecture and system design to ensure proper integration of the accelerator into the system. They utilize Intel® Quartus Prime development tools and leverage their firmware, hardware, and software expertise, along with a comprehensive documentation package and reference designs, to create their boards.

 

The Ares SoM reduces time to market for embedded projects and is compatible with Intel® Quartus Prime development tools. It complies with RoHS and REACH standards, demonstrating its adherence to environmental regulations.

 

The design of Reflex CES embedded systems follows industry standards and footprints to ensure seamless integration into the larger ecosystem. Standard interfaces and architectures enable efficient integration, and the system's footprint is carefully considered to meet size constraints. This approach results in efficient and effective embedded systems ready for the market.

Technical Specifications

Features           Ares Agilex™ 7 FPGA SoC F-Series
FPGA SoC

Agilex™ 7 FPGA SoC F-Series AGF012, AGFB012R24C2I2V, R24C package

1178 KLE, M20K 110Mbit, 3743 DSP Blocks

Quad Core Arm Cortex-A53 up to 1.43GHz

Transceiver speed grade 2, Core speed grade 2

Industrial Temp Grade

DDR4 Memory3 banks DDR4, 24 Gbyte total

HPS= 1 bank DDR4 x72bit bus, 8GByte, @2666MT/s

FPGA= 2 banks DDR4 x72bit bus, 8GByte each, @2666MT/s

ConnectorsTransceiver Mezzanine Connector

32 transceivers @32Gbps NRZ

OR up to 24 transceivers @58Gbps PAM4

(example: 16 transceivers @32Gbps NRZ + 16 @58Gbps PAM4)

 IO Mezzanine Connector

LVDS = 42 RX pairs and 42 TX pairs @1400Mbps

FPGA GPIOs = 140

HPS IO = depending used interfaces

FPGA Configuration2Gbit Quad SPI Flash (store up to 2 images)
Software Configuration

128Gbyte NAND Flash eMMC (Stores U-Boot, Linux Kernel, and RootFS)

(SD Card support on the carrier board)

HPS Communication1GbE RGMII, I2C, UART, USB 2.0 OTG, SPI slave and master, HPS IO
Mechanical & Environmental Specification

Module rugged for shocks and high vibration

IEC/EN61000 (EMI immunity), EN61000 + EN55032 (EMI emission),

EN60068 (Vibration: sinusoidal, 10Hz - 2KHz, +/- 0.15mm, 2g ; Shock: half-sinusoidal, 11ms, 15g)

5-15V Power Input

Industrial temperature grade -40°C to +70°C (to be qualified)

Conformal coating (option on request)

Power & Dissipation

Typ 113W, active airflow cooling (heat spreader + heatsink + fan)

fan noise < 50dB

Board Management Controller

Communication with Carrier board: I2C, PWM, JTAG

Communication with FPGA : 1x UART to FPGA

Monitoring : Current, voltages, temperature, ID information

Programming : Clock

Control: Power, temperature protection, Fans

Module dimensionsTBC: 107mm x 85mm (4.2 x 3.4 inches) / 12mm+ thickness (38.6mm with active heatsink and heat spreader)
Deliverables

• Ares module & its active heatsink system

• Board Support Package (to download from our online technical support) after purchase of a module and its carrier board:

Starter Guide, module and carrier board Reference Manuals, Interconnect pinout file

Mechanical drawings, assembly files

FPGA GHRD/GSRD Test Designs by interface (Quartus Prime Pro Edition 22.4)

BMC Software API

HPS Software:

-- Built with Yocto Project version 4.1 (langdale)

-- U-Boot bootloader (v2022.07), ATF Linux kernel (v5.15) and linux Poky distribution

• 1-year technical support and 1-year warrantee

• Online support at support.reflexces.com

Ordering Information

RXCAGF012PR24-SOM00I
Availability: Samples End Q4-2023
MOTS = Modified version on requestR24C package compatible from 800KLE (AGF008) up to 2.7MLE (AGF027)
Contact sales for customization