Lantronix Open-Q™ 820 µSOM

Micro System on Module Based on the Qualcomm® APQ8096 SoC

Lantronix’s Open-Q™ 820 µSOM is the world’s smallest production ready, pre-certified computing module based on Qualcomm’s® cutting edge Snapdragon™ 820 processor. The µSOM’s ultra-small size 50mm x 25mm, advanced technology, and extensive range of peripherals provide the perfect platform for creating high performance embedded and mobile devices.Includes an FCC/IC pre-certified WiFi/BT module to ease your product certification. Leverage the highly integrated, class leading µSOM to fast track your product development.

 

The Open-Q™ 820 uSOM is intended for OEMs planning on building a commercial product needing the smallest form factor Snapdragon™ 820 SOM on the market.

 

Processor

  • Snapdragon™ 820 (APQ8096)
    • Qualcomm® Kryo™ CPU Quad-Core, 64-bit, 2.2GHz
    • Qualcomm® Adreno™ 530 GPU
    • Qualcomm® Hexagon™ 680 DSP

Other Interfaces

  • 1x USB 3.0 client or host
  • 1x USB 2.0 client or host
  • 2x PCIe v2.1
  • 8x BLSP 4-pin port configurable as I2C, SPI, UART or GPIO
  • 1x SDIO

Memory

  • 3GB LPDDR4 RAM (1866 MHz )
  • 32GB UFS 2.0 Flash 1-lane, gear 3

Location

  • Qualcomm® IZat™ Gen 8C GPS

Wireless

  • Wi-Fi 802.11b/g/n/ac 2.4 / 5.0 GHz 2×2 MU-MIMO
  • Bluetooth 4.2, Bluetooth Low Energy
  • FCC and Industry Canada Pre-certified Wi-FI/BT Module

OS Support

  • Linux®, Android™ 7 Nougat, Android™ 8 Oreo™, Android™ 9 Pie

Display

  • 2x MIPI-DSI 4-lane, 60fps, up to 2560×1600 (single port), 4096×2160 (dual port)
  • 1x HDMI 2.0 up to 4096×2160, 60fps

Operating Environment

  • Input Power 3.6V to 4.2V
  • Operating Temperature -10°C to +70°C
  • Dimensions 50mm x 25mm

Camera

  • Qualcomm® Spectra™ ISP
  • 3x MIPI-CSI 4-lane, dual ISP, up to 28MP

Audio

  • 3x I2S
  • 1x PCM
  • 6x Analog in
  • 6x Analog out
  • 3x Digital mic

Specifications are subject to change without notice. Not all features listed may be supported in software. All brand or product names are trademarks or registered trademarks of their respective owners. Qualcomm Snapdragon, Qualcomm Kryo, Qualcomm Spectra, Qualcomm Adreno, Fluence and Qualcomm Hexagon are products of Qualcomm Technologies, Inc. Qualcomm IZat is a product of Qualcomm Atheros, Inc. Qualcomm, Snapdragon, Adreno, Fluence and Hexagon are trademarks of Qualcomm Incorporated, registered in the United States and other countries. Kryo, Spectra and IZat are trademarks of Qualcomm Incorporated. Used with permission.

Applications

  • Next-gen computer vision systems
  • Robotics / drones / UAVs
  • Industrial IoT
  • Digital Signage
  • Virtual reality / augmented reality applications
  • Stereo-vision cameras
  • Retail analytics cameras

Open-Q™ 820 µSOM Development Kit

Lantronix’s Open‐Q™ Snapdragon 820 µSOM Embedded Development Kit is a versatile, easy‐to‐use exposed board platform that uses our ultra-small form-factor µSOM. This development kit provides the ideal starting point for creating the next generation embedded and IoT devices. The platform consists of Lantronix’s Open‐Q™ 820 µSOM (Micro System on Module), a carrier board exposing all the available I/O, and a range of accessories to fast track your product development.

 

The Open-Q™ 820 µSOM development kit is intended for OEMs planning on building a commercial product needing the smallest form factor SOM on the market. The capabilities of the SOM are identical to Lantronix standard 820 SOM, except for the absence of the audio codec.

Open-Q™ 820 μSOM

  • Snapdragon™ 820 (APQ8096)
    • Qualcomm® Kryo™ CPU, Quad-Core, 64-bit, 2.2GHz
    • Qualcomm® Adreno™ 530 GPU
    • Qualcomm® Hexagon™ 680 DSP
    • Qualcomm® Spectra™ ISP
  • 3GB LPDDR4 RAM (1866 MHz)
  • 32GB UFS 2.0 Flash 1-lane, gear 3
  • Wi-Fi 802.11b/g/n/ac 2.4/5.0 GHz 2×2 MU-MIMO
  • Bluetooth 4.2, Bluetooth Low Energy
  • FCC and Industry Canada Pre-certified WiFi/BT Module
  • Qualcomm® IZat™ Gen 8C GPS
  • Qualcomm Hi-Fi Audio Codec

I/O

  • 1x UART debug (USB micro-B)
  • 2x USB 3.0 host Type A
  • 2x USB 3.0 host available through header
  • 1x USB 2.0 client, micro-AB
  • 2x PCIe 1x mini PCIe v1.2, 1x PCIe X1 slot v2.1
  • 1x µSD Socket
  • 1x SIM card slot
  • 8x Digital IO 4-pin port configurable as I2C, SPI, UART or GPIO

Audio

  • 1x 3.5mm ANC headset
  • 20pin Audio Input expansion header
  • 3x analog in
  • 3x digital in
  • 20pin Audio Output expansion header
  • 5x analog out
  • 1x digital out

Camera

  • 3x MIPI-CSI 4-lane, dual ISP, up to 28MP

Display Interfaces

  • 2x MIPI-DSI 4-lane, 60fps, up to 2560×1600 (single port), 4096×2160 (dual port)
  • 1x HDMI 2.0 up to 4096×2160, 60fps

OS Support

  • Linux®, Android™ 7 Nougat, Android™ 8 Oreo™, Android™ 9 Pie

Optional Accessories

  • Contact Macnica for More Details

Power Input

  • Input Power 12V

Dimensions

  • µSOM Dimension 50mm x 25mm
  • Carrier Board Dimension 170mm x 170mm