Lantronix Open-X™ 8M SoM and Dev Kit

Micro System on Module Based on the NXP® i.MX 8M™ Processor

Lantronix’s Open-X™ 8M System on Module (SOM) is an ultra-compact (55mmx35mm) production-ready SOM ideal for powering anything from consumer home video/audio to industrial building automation products. The feature-rich SOM, with industry-leading video/audio features and high speed Wi-Fi, is ideal for streaming devices, voice control applications, and human-machine interface solutions.

Processors

  • Quad-core ARM Cortex-A53 MPCore platform:
    • Quad symmetric Cortex-A53 processors: 32 KB L1 Instruction Cache, 32 KB L1 Data Cache
    • Support of 64-bit ARMv8-A architecture: 1 MB unified L2 cache, Frequency of 1.5 GHz
  • ARM Cortex-M4 core platform:
    • 16 KB L1 Instruction Cache, 16 KB L1 Data Cache, 256 KB tightly coupled memory (TCM)

Memory/Storage

  • 3GB LPDDR4 RAM
  • 16GB eMMC Flash

Video Processing Unit

  • 4Kp60 HEVC/H.265 main, and main 10 decoder
  • 4Kp60 VP9 decoder
  • 4Kp30 AVC/H.264 decoder
  • 1080p60 MPEG-2, MPEG-4p2, VC-1, VP8, RV9, AVS, MJPEG, H.263 decoder

Graphic Processing Unit

  • 4 shader
  • 267 million triangles/sec
  • 1.6 Giga pixel/sec
  • 32 GFLOPs 32-bit or 64 GFLOPs 16-bit
  • Supports OpenGL® ES 1.1, 2.0, 3.0, 3.1, Open CL™ 1.2, and Vulkan® 1.1

Display Interface

  • HDMI 2.0a supporting resolution up to 4096 x 2160 at 60 Hz
  • 4-lane MIPI DSI interface supporting display resolution up to 1920×1080 at 60 Hz

Camera Interface

  • 2x 4-lane MIPI CSI2 camera inputs

AudioInterfaces

  • S/PDIF input and output
  • 1x 16 channel bi-directional SAI digital audio interface supporting I2S, AC97, TDM, DSP
  • 1x 8 channel receive SAI digital audio interface (I2S, AC97, TDM, DSP)
  • 2x 2 channel bi-directional SAI digital audio interface (I2S, AC97, TDM, DSP)

I/O

  • 2x USB 3.0
  • 1x PCIe Gen2
  • Gigabit Ethernet
  • 4-bit SDIO
  • 2x debug UART
  • JTAG

Operating Environment

  • Input power: 3.3V
  • Operating Temperature: 0°C to +70°C (*for other temperature range options contact sales)

Form Factor

  • Size: 55mm x 35mm
  • Carrier Board Interface: 3 x 100 pin board to board connectors

Power Management

  • Power management IC: NXP PF4210

Wireless

  • WLAN 802.11a/b/g/n/ac 2.4/5.0 GHz 2×2 MU-MIMO + Bluetooth 4.1 pre-certified module
NXP approved Engineering Consulting Partner

OS Support

  • Android™ 8
  • Linux®

Open-X™ 8M Development Kit

Lantronix’s Open-X™ 8M Development Kit based on the NXP® i.MX 8M™ mini system on module is a cost-effective, feature rich, multimedia-focused, exposed board platform powered by our Open-X™ 8M SOM (System on Module). It is ideal for evaluation of the Open-X™ 8M SOM (System on Module) as well as jump-starting development of streaming video/audio devices, voice control and general human-machine interface solutions.

 

With a multitude of high performance interconnect options, including two USB3.0 ports, Gigabit Ethernet, PCIe Gen2, and pre-certified dual-band 2×2 MU-MIMO WLAN, this Dev Kit is ideal for development of a wide range of embedded and IoT.

Processor

  • Processor
    • Quad-core ARM Cortex-A53 MPCore at 1.5 GHz + single-core ARM Cortex-M4
  • Memory/Storage
    • 3GB LPDDR4 RAM, 16GB eMMC Flash
  • Wireless
    • WLAN 802.11a/b/g/n/ac 2.4/5.0 GHz 2×2 MU-MIMO + Bluetooth 4.1—pre-certified module (FCC/IC)

Display Interfaces

  • HDMI Type-A connector supporting HDMI 2.0a for 4096 x 2160 @ 60Hz
  • MIPI DSI display connector for optional LCD / Touch Panel to mount on carrier board

Optional Accessories

  • Contact Macnica for more detials

High Speed Connectivity

  • 1x USB3.0 Type-A
  • 1x USB3.0 Type-C
  • Gigabit Ethernet J45

Audio Interfaces

  • 3.5mm line-level stereo output
  • Audio expansion:
    • 1x 16 channel bi-directional SAI digital audio interface (I2S, AC97, TDM, DSP)
    • 1x 8 channel receive SAI digital audio interface (I2S, AC97, TDM, DSP)
    • 1x 2 channel receive SAI digital audio interface (I2S, AC97, TDM, DSP)
    • 1x S/PDIF input and output

Camera

  • 2 x MIPI CSI2 camera connectors for optional camera module

Expansion Sockets

  • M.2 socket with PCIe Gen2, USB HS, UART, I2C, I2S
  • microSD card socket

Debug Features

  • JTAG header
  • dual debug UART (1 Cortex-A53 debug, 1 Cortex-M4 debug) on USB serial micro-B

I/O expansion

  • I2C
  • NAND interface
  • GPIO

Power

  • Input Power: 12V/3A to barrel jack (power supply included) or USB Type-C power
  • Power probe header for SOM power consumption measurement

OS Support

  • Android™ 8
  • Linux®

Form Factor

  • SOM size: 55mm x 35mm
  • Carrier Board size: Mini-ITX 170mm x 170mm with on-board mounting for optional LCD panel
Wireless

Two WLAN/Bluetooth PCB antennas on carrier board with coaxial connection to SOM