IEI FLEX AIoT Developer Kit Gen. II

A Powerful Start for AI-based Projects

IEI has a smart platform for those looking to implement smart solutions such as Smart City, Smart Building, Smart Industry, or even Smart Medical systems.

 

 The IEI FLEX AIoT Kit (Gen II) brings industrial strength powerful processing with Intel® Core™ and Xeon™ processors, redundant drives, rich IO, and slots for optional IEI accelerators.  It’s all compatible with Intel’s OpenVINO toolset, libraries and models so developers get a head start on AI and Deep Learning projects.

 Customers have found the IEI FLEX Kit to be solid and field-deployable.

lfd
flex
  • 2U AI Modular PC with 10th Generation LGA 1200 Intel® Core™/Xeon® processor with Intel® Q470/W480 chipset and DDR4 memory
  • Four hot-swappable and accessible HDD drive bays support RAID 0/1/5/10
  • Support PCIe 3.0 by 4 and PCIe 3.0 by 8 slots
  • M.2 2280 PCIe 3.0 x4 NVMe™ SSD support
  • Dual independent display with high-resolution support
  • TPM data protection and reliable authentication
  • Support for optional Mustang-V100-MX8 PCIe Accelerator Card for offloading AI/DL workloads
  • Pre-installed Intel® AC 9260 802.11 AC 2T/2R and Bluetooth V5.1

Integrate AI into IoT applications. It’s not that difficult

Open the door to faster deployments of inference systems with the IEI FLEX AIoT Developer Kit Gen. II via Intel® Distribution of OpenVINO™ toolkit & Intel® Media SDK. 

Intel® Distribution of OpenVINO™ toolkit

Intel® Distribution of OpenVINO™ toolkit is based on convolutional neural networks (CNN); the toolkit extends workloads across multiple types of Intel® platforms and maximizes performance.

 

It can optimize pre-trained deep learning models such as Caffe, MXNET, and Tensorflow. The tool suite includes more than 20 pre-trained models, and supports 100+ public and custom models (including Caffe, MXNet, TensorFlow, ONNX, Kaldi) for easier deployments across Intel® silicon products (CPU, GPU/Intel® Processor Graphics, FPGA, VPU).

Hardware Features

Specifications

ModelFLEX-BX210AI-Series
System
CPUIntel® Xeon® W-1290TE 1.8GHz (up to 4.5GHz, 10-core, TDP 35W)
Intel® 10th Generation Core™ i9-10900TE 1.8GHz (up to 4.5GHz, 10-core, TDP 35W)
Intel® 10th Generation Core™ i5-10500TE 2.3GHz (up to 3.7GHz, 6-core, TDP 35W)
ChipsetIntel® 400 Series Chipsets (Comet Lake)
Memory2 x 288-pin 2933/2666 MHz dual-channel DDR4 unbuffered DIMM supporting up to 64GB
Xeon W with 32GB RAM Pre-installed
Core i9 with 16GB RAM Pre-installed
Core i5 with 8GB RAM Pre-installed
Graphics EngineIntel® HD Graphics Gen 9.5 Engines with Low power 16 execution unit, supports DX2015, OpenGL 5.X and OpenCL2.x, ES 2.0
EthernetLAN1: Intel® I219LM with Intel® AMT 11.0 supported
LAN2/LAN3: Intel® I210 PCIe controller
Storage
Storage4 x accessible 2.5” HDD/SSD SATA 6 Gb/s bay (with RAID 0/1/5/10 support) with LED indicator
1 x NGFF M.2(2280) M Key socket (support NVMe SSD) Pre-installed 1 x 2.5” 1TB HDD
Wireless Communication
WLANIntel® AC 9260 802.11ac, 2.5/5GHz, 2T/2R (by M.2 2230)
BluetoothBluetooth V5.1
WWAN and GNSSM.2 3042 LTE (optional)
I/O Ports and Switches
I/O Ports and Switches1 x Display port output
1 x HDMI output
3 x GbE LAN (1x I219 support vPro, 2x I210)
6 x USB 3.2 Gen1 Type-A
2 x RS-232 DB-9
1 x Mic in
1 x Line out
1 x AC inlet
4 x SMA
Power button with power LED (power on=Blue)
AT/ATX mode switch
Reset button
TPMTPM 2.0 (pre-installed)
Expansion Slots
Expansion Slots2 x PCIe 3.0 x8
2 x PCIe 3.0 x4
1 x M.2 B-Key 2242 socket (with SIM slot for 3G/LTE, supports PCIe 3.0 x1 & USB 3.2 Gen1)
1 x M.2 M-Key 2280 socket (supports PCIe 3.0 x4)
Thermal Solution
Thermal Solution3 x System fan, 1 x CPU cooler
Power supply
Power supplyAC input ATX power supply
- 350W Power supply
- Input: 90VAC~264VAC, 50/60Hz
- Output (max.): 3.3V@14A, 5V@16A, 12V@29A, -12V@0.3A
Watchdog Timer
Watchdog TimerSoftware programmable support 1~255 sec. system reset
Construction
Chassis ConstructionMetal housing
MountingWall/Rack mount
ColorBlack
Dimensions (LxDxH) (mm)357 x 230 x 88
Net Weight4 kgs
Environmental
Operating Temperature-10°C ~ 50°C
Storage Temperature-20°C ~ 60°C
Operating Humidity5% ~95%, non-condensing
Vibration5~17Hz, 0.1 double amplitude displacement 17~640Hz 1.5G acceleration peak to peak
Shock10G acceleration part to part (11ms)
Safety/EMCCE/FCC/RoHS

Ordering Information

Part No.Description
With Mustang-V100-MX8
FLEX-BX210AI-XE/32G/V-R102U AI Modular box PC, Intel® Xeon® W-1290TE 1.8GHz (up to 4.5GHz, 10-core, TDP 35W), 32GB DDR4, 2.5” 1TB HDD, TPM 2.0, 350W PSU, with Mustang-V100-MX8, Wi-Fi 802.11ac, R10
FLEX-BX210AI-i9/16G/V-R102U AI Modular box PC, Intel® 10th Generation Core™ i9-10900TE 1.8GHz (up to 4.5GHz, 10-core, TDP 35W), 16GB DDR4, 2.5” 1TB HDD, TPM 2.0, 350W PSU, with Mustang-V100-MX8, Wi-Fi 802.11ac, R10
FLEX-BX210AI-i5/8G/V-R102U AI Modular box PC, Intel® 10th Generation Core™ i5-10500TE 2.3GHz (up to 3.7GHz, 6-core, TDP 35W), 8GB DDR4, 2.5” 1TB HDD, TPM 2.0, 350W PSU, with Mustang-V100-MX8, Wi-Fi 802.11ac, R10
Without Mustang-V100-MX8
FLEX-BX210AI-XE/32G-R102U AI Modular box PC, Intel® Xeon® W-1290TE 1.8GHz (up to 4.5GHz, 10-core, TDP 35W), 32GB DDR4, 2.5” 1TB HDD, TPM 2.0, 350W PSU, Wi-Fi 802.11ac, R10
FLEX-BX210AI-i9/16G-R102U AI Modular box PC, Intel® 10th Generation Core™ i9-10900TE 1.8GHz (up to 4.5GHz, 10-core, TDP 35W), 16GB DDR4, 2.5” 1TB HDD, TPM 2.0, 350W PSU, Wi-Fi 802.11ac, R10
FLEX-BX210AI-i5/8G-R102U AI Modular box PC, Intel® 10th Generation Core™ i5-10500TE 2.3GHz (up to 3.7GHz, 6-core, TDP 35W), 8GB DDR4, 2.5” 1TB HDD, TPM 2.0, 350W PSU, Wi-Fi 802.11ac, R10

Don't Forget to Ask About IEI's Accelerators for the FLEX Kit

Mustang-F100

About IEI Integration Corporation

 

IEI is known for:

 

Industrial and medical computing and network products and instruments, embedded boards and systems, as well as AI and edge processing solutions.  With several award winning solutions, IEI has demonstrated leadership in the market.  They have alliances with Intel®, Microsoft® and Amazon for their leading edge technology.