HAGIWARA Solutions

Hagiwara Solutions
Hagiwara Solutions

NVMe

Do you need larger capacity with faster I/F? If yes, Macnica ATD Europe offers Hagiwara's NVMe.

There are secure models with AES 256-bit, TCG Opal, Sanitize Block Erase, Sanitize Overwrite and Sanitize Crypto Scramble.

 

Such faster I/F requires temperature management. Then, Hagiwara supports Thermal Throttling Function to control the speed to optimize the temperature for the best performance.

U.2 (GEN3): 3D NAND

NAND3D TLC
P/E Cycles3.000
InterfacePCIe Gen 3 x 4
CapacityFrom 960GB to 3,840GB
Supply Voltage12V
Operating Temperature-40°C to +85°C
Storage Temperature-45°C to +90°C
TBW390TB – 4,850TB
Max Sequential Read/Write2,850 / 1,400 (MB/s)
Form Factor69.85 x 100.00 x 7.00 (mm)
FeaturesMax Sequential Read 2,850 MB/s - 1, 2, and 4TB - Optional security: AES 256-bit, TCG Opal, Sanitize Crypto Scramble, Sanitize Block Erase and Sanitize Overwrite - I-Temp & C-Temp - Support Diagnosis Software “Live Monitor Plus” - Fixed BOM (Main parts) - Long-Term Supply - CE/FCC/VCCI/RoHS
Part NumberFSN2E-VJ Series
NAND3D TLC
P/E Cycle3,000
InterfacePCIe Gen 3 x 4
CapacityFrom 960GB to 3,840GB
Supply Voltage12V
Operating Temperature-40°C to +85°C
Storage Temperature-45°C to +90°C
TBW390TB – 4,850TB
Max Sequential Read/Write2,850 / 1,400 (MB/s)
Form Factor69.85 x 100.00 x 7.00 (mm)
Features- Max Sequential Read 2,850 MB/s - 1, 2, and 4TB - Optional security: AES 256-bit, TCG Opal, Sanitize Crypto Scramble, Sanitize Block Erase and Sanitize Overwrite - I-Temp & C-Temp - Support Diagnosis Software “Live Monitor Plus” - Fixed BOM (Main parts) - Long-Term Supply - CE/FCC/VCCI/RoHS
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Features

  • Max Sequential Read 2,850 MB/s
  • 1, 2, and 4TB
  • Optional security: AES 256-bit, TCG Opal, Sanitize Crypto Scramble, Sanitize Block Erase and Sanitize Overwrite
  • I-Temp & C-Temp
  • ​Support Diagnosis Software “Live Monitor Plus”
  • Fixed BOM (Main parts)
  • Long-Term Supply
  • CE/FCC/VCCI/RoHS

U2 (GEN4): 3D NAND

Part NumberFSN2E-WC SeriesFXN2E-WC Series
NAND3D TLC3D TLC
P/E Cycles3,0003,000
InterfacePCIe Gen 4 x 4PCIe Gen 4 x 4
CapacityFrom 960GB to 3,840GB7,680GB
Supply Voltage12V12V
Operating TmperatureStandard Temperature: 0°C to +70°C, Wide Temperature: -40°C to +85°CStandard Temperature: 0°C to +70°C, Wide Temperature: -40°C to +85°C
Storage TemperatureStandard Temperature: -40°C to +85°C, Wide Temperature: -45°C to +90°CStandard Temperature: -40°C to +85°C, Wide Temperature: -45°C to +90°C
TBW1,000TB – 4,000TB8,000TB
Max Sequential Read/Write3,000/ 2,900 (MB/s)3,050/ 2,900 (MB/s)
Form Factor69.85 x 100.00 x 7.00 (mm)69.85 x 100.00 x 7.00 (mm)
Features- Max Sequential Read 3,000 MB/s - 1, 2, 4 and 8TB - Optional security: AES 256-bit, TCG Opal, Sanitize Crypto Scramble, Sanitize Block Erase and Sanitize Overwrite - I-Temp & C-Temp (I-Temp:Under Development) - Support Diagnosis Software “Live Monitor Plus” - Fixed BOM (Main parts) - Long-Term Supply - CE/FCC/VCCI/UKCA/RoHS- Max Sequential Read 3,000 MB/s - 1, 2, 4 and 8TB - Optional security: AES 256-bit, TCG Opal, Sanitize Crypto Scramble, Sanitize Block Erase and Sanitize Overwrite - I-Temp & C-Temp (I-Temp:Under Development) - Support Diagnosis Software “Live Monitor Plus” - Fixed BOM (Main parts) - Long-Term Supply - CE/FCC/VCCI/UKCA/RoHS

Features

  • Max Sequential Read 3,000 MB/s
  • 1, 2, 4 and 8TB
  • Optional security: AES 256-bit, TCG Opal, Sanitize Crypto Scramble, Sanitize Block Erase and Sanitize Overwrite
  • I-Temp & C-Temp (I-Temp:Under Development)
  • Support Diagnosis Software “Live Monitor Plus”
  • Fixed BOM (Main parts)
  • Long-Term Supply
  • CE/FCC/VCCI/UKCA/RoHS

M.2 2280 (GEN3): 3D NAND

Part NumberFSN8E-VP/VJ Series
NAND3D TLC
P/E Cycles3,000
InterfacePCIe Gen 3 x 4
CapacityFrom 240GB to 3,840GB
Supply Voltage3.3V
Operating Temperature-40°C to +85°C
Storage Temperature-45°C to +90°C
TBW90TB – 4,850TB
Max Sequential Read/Write2,850 / 1,500 (MB/s)
Form Factor22.00 x 80.00 x 3.600 (mm)
Features- Max Sequential Read 2,850 MB/s - 1, 2, and 4TB - Optional security: AES 256-bit, TCG Opal, Sanitize Crypto Scramble, Sanitize Block Erase and Sanitize Overwrite - I-Temp & C-Temp - Support Diagnosis Software “Live Monitor Plus” - Fixed BOM (Main parts) - Long-Term Supply - CE/FCC/VCCI/RoHS

Features

  • Max Sequential Read 2,850 MB/s
  • 1, 2, and 4TB
  • Optional security: AES 256-bit, TCG Opal, Sanitize Crypto Scramble, Sanitize Block Erase and Sanitize Overwrite
  • I-Temp & C-Temp
  • ​Support Diagnosis Software “Live Monitor Plus”
  • Fixed BOM (Main parts)
  • Long-Term Supply
  • CE/FCC/VCCI/RoHS

M.2 2280 (GEN4): 3D NAND

Part NumberFSN8E-WC Series
NAND3D TLC
P/E Cycles3,000
InterfacePCIe Gen 4 x 4
CapacityFrom 960GB to 3,840GB
Storage TemperatureStandard Temperature: -40°C to +85°C, Wide Temperature: -45°C to +90°C
TBW1,000TB – 4,000TB
Max Sequential Read/Write2,850 / 2,750 (MB/s)
Operating TemperatureStandard Temperature: 0°C to +70°C, Wide Temperature: -40°C to +85°C
Part NumberFSN8E-WC Series
NAND3D TLC
P/E Cycles3,000
InterfacePCIe Gen 4 x 4
CapacityFrom 960GB to 3,840GB
Operating TemperatureStandard Temperature: 0°C to +70°C, Wide Temperature: -40°C to +85°C
Storage TemperatureStandard Temperature: -40°C to +85°C, Wide Temperature: -45°C to +90°C
TBW1,000TB – 4,000TB
Max Sequential Read/Write2,850 / 2,750 (MB/s)

Features

  • Sequential Read 2,850MB/s
  • 1, 2, and 4TB
  • Optional security: AES 256-bit, TCG Opal, Sanitize Crypto Scramble, Sanitize Block Erase and Sanitize Overwrite
  • I-Temp & C-Temp (I-Temp:Under Development)
  • Support Diagnosis Software “Live Monitor Plus”
  • Fixed BOM (Main parts)
  • Long-Term Supply
  • CE/FCC/VCCI/UKCA/RoHS

CF Express *Under Development: 3D NAND

Part NumberCF Express (Type B)
NAND3D TLC
P/E Cycles3,000
InterfacePCIe Gen 3 x 2
CapacityFrom 120GB to 960GB
OPerating Temperature-40°C to +85°C
TBW75TB – 600TB
Max Sequential Read/Write1,800 / 1,200 (MB/s)

Features

  • Sequential Read 1,800 MB/s
  • Max 1TB
  • Optional Security: AES 256-bit, TCG Opal, Sanitize Crypto Scramble, Sanitize Block Erase and Sanitize Overwrite
  • I-Temp & C-Temp
  • Support Diagnosis Software “Live Monitor Plus”
  • Fixed BOM (Main parts)
  • Long-Term Supply

SATA

SATA is the mainstream of flash storages. 

It is available in multiple NANDs (2D SLC, 2D MLC, 3D TLC and 3D pSLC), with I-Temp and C-Temp.

In addition, as a counter measure against power loss, Hagiwara supports Rollback & Tracing on their SSD.

2.5inch: 3D NAND

Part NumberSN2S-QLN/LI SeriesHN2S-QLI Series
NAND3D TLC3D TLC (SLC Mode)
P/E Cycles3,00060,000
InterfaceSATA 6.0GbpsSATA 6.0Gbps
Capacity120GB – 1,920GB40GB-640GB
Voltage5V5V
Operating TemperatureStandard Temperature: 0°C to +70°C, Wide Temperature: -40°C to +85°CWide Temperature: -40°C to +85°C
Storage Temperature-40°C to +85°C-40°C to +85°C
TBW110TB – 1,510TB1,600TB – 38,400TB
Max Sequential Read/Write520 / 450(MB/s)520 / 450(MB/s)
Form Factor (mm)69.85 x 100 x 6.8569.85 x 100 x 6.85

Features

  • On-chip adaptive RAID for reliable failover (Die RAID)
  • Dedicated power loss data protection circuitry   (Rollback & Trace)
  • Advanced ECC for 3D NAND
  • Optional Security: AES 256-bit encryption, TCG Opal
  • Page Mapping & Ware Leveling
  • Support Diagnosis Software “Live Monitor Plus”
  • Support “VWF (Vurtial Write Filter)” function * Function to filter writing to SSD (Dedicated tool is required)
  • Fixed BOM (Main parts)
  • Failure Analysis Service
  • Long-Term Supply
  • CE/FCC/VCCI/UKCA/UL/RoHS

2.5inch: 2D NAND

Part NumberHFD25S-GD Series
NAND2D SLC
P/E Cycles1,00,000
InterfaceSATA 6Gbps
CapacityFrom 7GB to 120GB
Supply Voltage5V
Operating TemperatureStandard Temperature: 0°C to +70°C, Wide Temperature: -40°C to +85°C
Storage Temperature-45°C to +90°C
TBW260TB – 9,700TB
Max Sequential Read/Write500 / 380 (MB/s)
Form Factor 69.85 x 99.90 x 7.00 (mm)

Features

  • Dedicated power loss data protection circuitry  (Rollback & Trace)
  • Page Mapping & Ware Leveling
  • Support Diagnosis Software “Live Monitor”
  • Fixed BOM (Main parts)
  • Failure Analysis Service
  • Supply 2D SLC through 2026

M.2 2242: 3D NAND

Part NumberSN4S-GP SeriesRN4S-GP SeriesHN4S-GP Series
NAND3D TLC3D TLC (MLC mode)3D TLC (SLC mode)
P/E Cycles2,000 (Standard Temp.) 3,000(Wide Temp.)8,000(Standard Temp.) 10,000(Wide Temp.)40,000(Standard Temp.) 50,000(Wide Temp.)
InterfaceSATA 6GbpsSATA 6GbpsSATA 6Gbps
Capacity60GB – 480GB40GB – 320GB20GB – 160GB
Supply Voltage3.3V3.3V3.3V
Operating TemperatureStandard Temperature: 0°C to +70°C, Wide Temperature: -40°C to +85°CStandard Temperature: 0°C to +70°C, Wide Temperature: -40°C to +85°CStandard Temperature: 0°C to +70°C, Wide Temperature: -40°C to +85°C
Storage Temperature-40°C to +85°C-40°C to +85°C-40°C to +85°C
TBW30TB – 180TB90TB – 1,000TB470TB – 4,860TB
Max Sequential Read/Write520/ 375 (MB/s)520 / 435 (MB/s)500 / 430 (MB/s)
Form Factor (mm)22.00 x 42.00 x 3.8022.00 x 42.00 x 3.8022.00 x 42.00 x 3.80

Features

  • On-chip adaptive RAID for reliable failover (Die RAID)
  • Dedicated power loss data protection circuitry (Rollback & Trace)
  • Advanced ECC for 3D NAND
  • Page Mapping & Ware Leveling
  • Support Diagnosis Software “Live Monitor Plus”
  • Support “VWF (Vurtial Write Filter)” function *Function to filter writing to SSD (Dedicated tool is required)
  • Fixed BOM (Main parts)
  • Failure Analysis Service
  • Long-Term Supply
  • CE/FCC/VCCI/RoHS

M.2 2280: 3D NAND

Part NumberSN8S-QLN SeriesHN8S-QLI SeriesHP8S-QLI Series (Instantaneous power failure masure model)
NAND3D TLC3D TLC (SLC mode)3D TLC (SLC mode)
P/E Cycles3,00060,00060,000
InterfaceSATA 6.0GbpsSATA 6.0GbpsSATA 6.0Gbps
Capacity120GB-1,920GB40GB – 640GB80GB – 320GB
Supply Voltage3.3V3.3V3.3V
Operating Temperature0°C to +70°C-40°C to +85°C-40°C to +85°C
Storage Temperature-40°C to +85°C-40°C to +85°C-40°C to +85°C
TBW110TB – 1510TB1,600TB – 38,400TB1,600TB – 38,400TB
Max Sequential Read/Write520 / 450(MB/s)520 / 450(MB/s)520 / 440 (MB/s)
Form Factor (mm)22.00 x 80.00 x 3.6022.00 x 80.00 x 3.6022.00 x 80.00 x 3.60

Features

  • On-chip adaptive RAID for reliable failover (Die RAID)
  • Dedicated power loss data protection circuitry (Rollback & Trace)
  • Advanced ECC for 3D NAND
  • Data purge / instant erase
  • Optional Security: AES 256-bit encryption, TCG Opal
  • Page Mapping & Ware Leveling
  • Support Diagnosis Software “Live Monitor Plus”
  • Support “VWF (Vurtial Write Filter)” function * Function to filter writing to SSD (Dedicated tool is required)
  • Fixed BOM (Main parts)
  • Failure Analysis Service
  • Long-Term Supply
  • CE/FCC/VCCI/UKCA/RoHS

M.2 2280: 2D NAND

Part NumberHFDM8S-GD Series
NAND2D SLC
P/E Cycles1,00,000
InterfaceSATA 6.0Gbps
Capacity 16GB to 128GB
Supply Voltage3.3V
Operating Temperature 0°C to +70°C
Storage Temperature-45°C to +95°C
TBW470TB – 3,700TB
Max Sequential Read/Write4700 / 350 (MB/s)
Form Factor (mm)22.00 x 80.00 x 3.85

Features

  • Dedicated power loss data protection circuitry (Rollback & Trace)
  • Page Mapping & Ware Leveling
  • Support Diagnosis Software “Live Monitor”
  • Fixed BOM (Main parts)
  • Failure Analysis Service
  • Supply 2D SLC through 2026

mSATA: 3D NAND

Part NumberHNMS-GP SeriesRNMS-GP SeriesSNMS-GP Series
NAND3D TLC3D TLC (MLC mode)3D TLC (SLC mode)
P/E Cycles2,000 (Standard Temp.) 3,000(Wide Temp.)8,000(Standard Temp.) 10,000(Wide Temp.)40,000(Standard Temp.) 50,000(Wide Temp.)
InterfaceSATA 6.0GbpsSATA 6.0GbpsSATA 6.0Gbps
Capacity60GB–240GB40GB–320GB20GB–160GB
Supply Voltage3.3V3.3V3.3V
Operating TemperatureStandard Temperature: 0°C to +70°C, Wide Temperature: -40°C to +85°CStandard Temperature: 0°C to +70°C, Wide Temperature: -40°C to +85°CStandard Temperature: 0°C to +70°C, Wide Temperature: -40°C to +85°C
Storage Temperature-40°C to +85°C-40°C to +85°C-40°C to +85°C
TBW30TB–180TB90TB–1,000TB470TB–4,860TB
Max Sequential Read/Write495 / 375 (MB/s)500 / 430 (MB/s)500 / 430 (MB/s)
Form Factor (mm)29.85 x 50.80 x 4.8529.85 x 50.80 x 4.8529.85 x 50.80 x 4.85

Features

  • On-chip adaptive RAID for reliable failover (Die RAID)
  • Dedicated power loss data protection circuitry  (Rollback & Trace)
  • Advanced ECC for 3D NAND
  • Page Mapping & Ware Leveling
  • Support Diagnosis Software “Live Monitor Plus”
  • Support “VWF (Vurtial Write Filter)” function *Function to filter writing to SSD (Dedicated tool is required)
  • Fixed BOM (Main parts)
  • Failure Analysis Service
  • Long-Term Supply
  • CE/FCC/VCCI/RoHS

mSATA: 2D NAND

Part NumberHFDMSS-GD Series
NAND2D SLC
P/E Cycles1,00,000
InterfaceSATA 6.0Gbps
Capacity 7GB to 60GB
Supply Voltage3.3V
Operating TemperatureStandard Temperature: 0°C to +70°C, Wide Temperature: -40°C to +85°C
Storage Temperature-45°C to +95°C
TBW260TB–2,100TB
Max Sequential Read/Write470 / 330 (MB/s)
Form Factor (mm)29.85 x 50.80 x 4.85

Features

  • Dedicated power loss data protection circuitry   (Rollback & Trace)
  • Page Mapping & Ware Leveling
  • Support Diagnosis Software “Live Monitor”
  • Fixed BOM (Main parts)
  • Failure Analysis Service
  • Long-Term Supply

CFast: 3D NAND

Part NumberSN1S-QLI SeriesHN1S-QLI Series
NAND3D TLC3D TLC (SLC Mode)
P/E Cycles3,00060,000
InterfaceSATA 6.0GbpsSATA 6.0Gbps
Capacity120GB – 960GB40GB-320GB
Voltage3.3V3.3V
Operating Temperature-40°C to +85°C-40°C to +85°C
Storage Temperature-40°C to +85°C-40°C to +85°C
TBW110TB – 720TB1,600TB – 16,000TB
Max Sequential Read/Write520 / 430(MB/s)520 / 450(MB/s)
Form Factor (mm)36.40 x 42.80 x 3.6036.40 x 42.80 x 3.60

Features

  • On-chip adaptive RAID for reliable failover (Die RAID)
  • Dedicated power loss data protection circuitry (Rollback & Trace)
  • Advanced ECC for 3D NAND
  • Data purge / instant erase
  • Optional Security: AES 256-bit encryption, TCG Opal
  • Page Mapping & Ware Leveling
  • Support Diagnosis Software “Live Monitor Plus”
  • Support “VWF (Vurtial Write Filter)” function *Function to filter writing to SSD (Dedicated tool is required)
  • Fixed BOM (Main parts)
  • Failure Analysis Service
  • Long-Term Supply
  • CE/FCC/VCCI/UKCA/RoHS

CFast: 2D NAND

Part NumberHFD10S-GD Series
NAND2D SLC
P/E Cycles1,00,000
InterfaceSATA 6.0Gbps
Capacity 7GB to 60GB
 Voltage3.3V
Operating TemperatureStandard Temperature: 0°C to +70°C, Wide Temperature: -40°C to +85°C
Storage Temperature-45°C to +90°C
TBW260TB–2,100TB
Max Sequential Read/Write470 / 350 (MB/s)
Form Factor (mm)36.40 x 42.80 x 3.60

Features

  • Dedicated power loss data protection circuitry (Rollback & Trace)
  • Page Mapping & Ware Leveling
  • Support Diagnosis Software “Live Monitor”
  • Fixed BOM (Main parts)
  • Failure Analysis Service
  • Supply 2D SLC through 2026

PATA

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Are you looking for CompactFlash? How do you obtain for your legacy projects Hagiwara supplies CompactFlash (The Longest-Term-Supply models) until 2027.

1inch / CompactFlash: 2D NAND

Part NumberHCF10P-RE Series (CompactFlash)HFD10P-RE SeriesMCF10P-VM Series (CompactFlash)　MFD10P-VM Series
NAND2D SLC2D SLC2D SLC2D SLC
P/E Cycles1,00,0001,00,00050,00050,000
Interface- PC card memory mode - PC card I/O mode - True IDE mode- PIO mode 0-4 - Multiword DMA mode 0-2 - Ultra DMA mode0-4 - ATA command set compatible- PC card memory - PC card I/O - True IDE- PIO mode 0-4 - Multiword DMA mode 0-2 - Ultra DMA mode0-4 - ATA command set compatible
Capacity512MB – 64GB512MB – 64GB512MB – 8GB512MB – 8GB
Voltage3.3V / 5V3.3V / 5V3.3V / 5V3.3V / 5V
Operating TemperatureStandard Temperature: 0°C to +70°C *16/32/64GB Only, Wide Temperature: -40°C to +85°CStandard Temperature: 0°C to +70°C *16/32/64GB Only, Wide Temperature: -40°C to +85°C-40°C to +85°C-40°C to +85°C
Storage Temperature-45°C to +90°C-45°C to +90°C-45°C to +90°C-45°C to +90°C
Max Sequential Read/Write60 / 45 (MB/s)60 / 45 (MB/s)48 / 28 (MB/s)48 / 28 (MB/s)
Form Factor (mm)36.40 x 42.80 x 3.3036.40 x 42.80 x 3.3036.40 x 42.80 x 3.3036.40 x 42.80 x 3.30

Features

  • Dedicated power loss data protection circuitry (Rollback & Trace)
  • Data purge / instant erase
  • Page Mapping & Ware Leveling
  • Support Diagnosis Software “Live Monitor”
  • Fixed BOM (Main parts)
  • Failure Analysis Service
  • Supply 2D SLC through 2026

 

SD (SD, microSD and eSD)

Hagiwara's SD/ microSD and eSD are available with multiple NANDs (2D SLC, 2D MLC, 3D TLC and 3D pSLC)

with I-Temp and C-Temp.

eSD (Embedded SD): 2D NAND

Achieves reliability for SD cards for industrial equipment with onboard storage Front-mounting SD card with I/F (JEDEC 100-Ball BGA). Utilizes SLC-type memory components to achieve an overwriting life ten times that of the eMMC. A new addition to our lineup that combines reliability with a smaller footprint for the host equipment.

Part NumberBSD6-SE SeriesBSDB-SE Series
NAND2D SLC2D SLC
P/E Cycles50,0001,00,000
CapacityFrom 512MB to 2GBFrom 4GB to 16GB
Supply Voltage2.7V – 3.6V2.7V – 3.6V
Operating Temperature-40°C to +85°C-40°C to +85°C
Storage Temperature-40°C to +85°C-40°C to +85°C
Max Sequential Read/Write20 / 17 (MB/s)89 / 70 (MB/s)
Speed ClassSpeed Class 6Speed Class 10
Package100ball BGA100ball BGA
Dimensions14 x 18 x 1.3 (mm)14 x 18 x 1.3 (mm)

Features

  • Dedicated power loss data protection circuitry   (Data Block Recovery)
  • Refresh functions for errors prevention from Read Disturb
  • Page Mapping & Ware Leveling
  • Support Diagnosis Software LivemonitorPlus
  • Fixed BOM (Main parts)
  • Failure Analysis Service
  • CPRM not supported
  • Supply 2D SLC through 2026

SD Card: 3D NAND

Part NumberNSDB-GK (RTJ Series)NSDB-GK (STLS Series)
NAND3D TLC3D TLC
P/E Cycles2,0003,000
Capacity16GB – 256GB64GB – 256GB
Supply Voltage2.7V – 3.6V2.7V – 3.6V
Operating Temperature-25°C to +85°C (16GB – 128GB) -40°C to +85°C (256GB)-25°C to +85°C
Storage Temperature-40°C to +85°C-40°C to +85°C
Max Sequential Read/Write86 / 29 (MB/s)90 / 80 (MB/s)
Speed ClassSpeed Class 10, UHS Speed Grade 1, Video Speed Class 10(16GB) / 30(64GB/128GB/256GB), Application Performance Class A1Speed Class 10, UHS Speed Grade 3, Video Speed Class 30, Application Performance Class A2
Dimension24.00 x 32.00 x 2.10 (mm)24.00 x 32.00 x 2.10 (mm)

Features

  • Dedicated power loss data protection circuitry   (Data Block Recovery)
  • Refresh functions for errors prevention from Read Disturb
  • Page Mapping & Ware Leveling
  • Support Diagnosis Software “Live Monitor Plus”
  • Fixed BOM (Main parts)
  • Failure Analysis Service
  • Long-Term Supply
  • CPRM not supported
  • CE/FCC/VCCI/UKCA/RoHS
Part NumberNSDx-GK (RSJ Series)NSDB-GK (SSL Series)
NAND3D TLC (SLC mode)3D TLC (SLC mode)
P/E Cycles30,00030,000
Capacity2GB – 4GB16GB – 64GB
Supply Voltage2.7V – 3.6V2.7V – 3.6V
Operating Temperature-25°C to +85°C-25°C to +85°C
Storage Temperature-40°C to +85°C-40°C to +85°C
Max Sequential Read/Write2GB: 20 / 20 (MB/s), 4GB: 90 / 80 (MB/s)90 / 80 (MB/s)
Speed ClassSpeed Class 6(2GB) / 10(4GB), UHS Speed Grade 3, Video Speed Class 30, Application Performance Class A1Speed Class 10, UHS Speed Grade 3, Video Speed Class 30, Application Performance Class A2
Dimension24.00 x 32.00 x 2.10 (mm)24.00 x 32.00 x 2.10 (mm)

Features

  • Dedicated power loss data protection circuitry  (Data Block Recovery)
  • Refresh functions for errors prevention from Read Disturb
  • Page Mapping & Ware Leveling
  • Support Diagnosis Software “Live Monitor Plus”
  • Fixed BOM (Main parts)
  • Failure Analysis Service
  • Long-Term Supply
  • CPRM not supported
  • CE/FCC/VCCI/UKCA/RoHS
Part NumberNSDB-GS (VSK Series)NSDB-GS (VSLS Series)
NAND3D TLC (SLC mode)3D TLC (SLC mode)
P/E Cycles30,00030,000
Capacity8GB – 64GB16GB – 128GB
Supply Voltage2.7V – 3.6V2.7V – 3.6V
Operating Temperature-25°C to +85°C-25°C to +85°C
Storage Temperature-40°C to +85°C-40°C to +85°C
Max Sequential Read/Write90 / 60 (MB/s)65 / 55 (MB/s)
Speed Class Speed Class 10, UHS Speed Grade 1, Application Performance Class A1
Dimension24.00 x 32.00 x 2.10 (mm)24.00 x 32.00 x 2.10 (mm)

Features

  • Dedicated power loss data protection circuitry  (Data Block Recovery)
  • Refresh functions for errors prevention from Read Disturb
  • Page Mapping & Ware Leveling
  • Support Diagnosis Software “Live Monitor Plus”
  • Fixed BOM (Main parts)
  • Failure Analysis Service
  • Long-Term Supply
  • CPRM not supported
  • CE/FCC/VCCI/UKCA/RoHS

SD Card: 2D NAND

Part NumberNSDx-S (SEI Series)NSDx-K (LSE Series)
NAND2D SLC 2D SLC
P/E Cycles50,0001,00,000
Capacity512GB –  32GB128GB – 16GB
Supply Voltage2.7V – 3.6V2.7V – 3.6V
Operating Temperature-40°C to +85°C-25°C to +85°C (128MB – 16GB), -40°C to +85°C (512MB – 16GB)
Storage Temperature-40°C to +85°C-40°C to +85°C
Max Sequential Read/Write512MB-2GB: 19 / 15 (MB/s), 4GB-32GB: 89 / 70 (MB/s)128MB: 18 / 3 (MB/s), 512MB – 2GB: 20 / 18 (MB/s), 4GB – 16GB: 88 / 79 (MB/s)
Speed ClassSpeed Class 6(512MB/1GB/2GB) / 10(4GB-32GB), UHS Speed Class 1Speed Class 10, UHS Speed Class 1
Dimension24.00 x 32.00 x 2.10 (mm)24.00 x 32.00 x 2.10 (mm)

Features

  • Dedicated power loss data protection circuitry (Data Block Recovery)
  • Refresh functions for errors prevention from Read Disturb
  • Page Mapping & Ware Leveling
  • Support Diagnosis Software “Live Monitor”
  • Fixed BOM (Main parts)
  • Failure Analysis Service
  • CPRM not supported
  • CE/FCC/VCCI/UKCA/RoHS
  • Supply 2D SLC through 2026

Micro SD: 3D NAND

Part NumberMSDB-GK (RTJ Series)MSDB-GK (STLS Series)
NAND3D TLC 3D TLC
P/E Cycles2,0003,000
Capacity16GB –  256GB64GB –256GB
Supply Voltage2.7V – 3.6V2.7V – 3.6V
Operating Temperature-25°C to +85°C (16GB – 128GB), -40°C to +85°C (256GB)-25°C to +85°C
Storage Temperature-40°C to +85°C-40°C to +85°C
Max Sequential Read/Write86 / 29 (MB/s)90 / 80 (MB/s)
Speed ClassSpeed Class 10, UHS Speed Grade 1, Video Speed Class 10(16GB) / 30(64GB/128GB/256GB), Application Performance Class A1Speed Class 10, UHS Speed Grade 3, Video Speed Class 30, Application Performance Class A2
Dimension11.00 x 15.00 x 1.00 (mm)11.00 x 15.00 x 1.00 (mm)

Features

  • Dedicated power loss data protection circuitry  (Data Block Recovery)
  • Refresh functions for errors prevention from Read Disturb
  • Page Mapping & Ware Leveling
  • Support Diagnosis Software “Live Monitor Plus”
  • Fixed BOM (Main parts)
  • Failure Analysis Service
  • Long-Term Supply
  • CPRM not supported
  • CE/FCC/VCCI/UKCA/RoHS
Part NumberMSDx-GK (RSJ Series)MSDB-GK (SSL Series)
NAND3D TLC (SLC mode)3D TLC (SLC mode)
P/E Cycles30,00030,000
Capacity2GB –  4GB16GB –64GB
Supply Voltage2.7V – 3.6V2.7V – 3.6V
Operating Temperature-25°C to +85°C -25°C to +85°C
Storage Temperature-40°C to +85°C-40°C to +85°C
Max Sequential Read/Write2GB: 20 / 20 (MB/s), 4GB: 90 / 80 (MB/s)90 / 80 (MB/s)
Speed ClassSpeed Class 6(2GB) / 10(4GB), UHS Speed Grade 3, Video Speed Class 30, Application Performance Class A1Speed Class 10, UHS Speed Grade 3, Video Speed Class 30, Application Performance Class A2
Dimension11.00 x 15.00 x 1.00 (mm)11.00 x 15.00 x 1.00 (mm)

Features

  • Dedicated power loss data protection circuitry  (Data Block Recovery)
  • Refresh functions for errors prevention from Read Disturb
  • Page Mapping & Ware Leveling
  • Support Diagnosis Software “Live Monitor Plus”
  • Fixed BOM (Main parts)
  • Failure Analysis Service
  • Long-Term Supply
  • CPRM not supported
  • CE/FCC/VCCI/UKCA/RoHS
Part NumberMSDB-GS (VSK Series)MSDB-GS (VSLS Series)
NAND3D TLC (SLC Mode)3D TLC (SLC mode)
P/E Cycles30,00030,000
Capacity8GB –  64GB16GB –128GB
Supply Voltage2.7V – 3.6V2.7V – 3.6V
Operating Temperature-25°C to +85°C-25°C to +85°C
Storage Temperature-40°C to +85°C-40°C to +85°C
Max Sequential Read/Write90 / 60 (MB/s)65 / 55 (MB/s)
Speed ClassSpeed Class 10, UHS Speed Grade 1, Application Performance Class A1Speed Class 10, UHS Speed Grade 1, Application Performance Class A1
Dimension11.00 x 15.00 x 1.00 (mm)11.00 x 15.00 x 1.00 (mm)

Features

  • Dedicated power loss data protection circuitry  (Data Block Recovery)
  • Refresh functions for errors prevention from Read Disturb
  • Page Mapping & Ware Leveling
  • Support Diagnosis Software “Live Monitor Plus”
  • Fixed BOM (Main parts)
  • Failure Analysis Service
  • Long-Term Supply
  • CPRM not supported
  • CE/FCC/VCCI/UKCA/RoHS

Micro SD: 2D NAND

Part NumberMSDx-xK (SEI Series)MSDx-xS (NSE Series)
NAND2D SLC2D SLC
P/E Cycles50,00050,000
Capacity128MB –2GB1GB – 8GB
Supply Voltage2.7V – 3.6V2.7V – 3.6V
Operating Temperature-25°C to +85°C-40°C to +85°C
Storage Temperature-40°C to +85°C-40°C to +85°C
Max Sequential Read/Write20 / 18 (MB/s)30 / 27 (MB/s)
Speed ClassSpeed Class 6Speed Class 10, UHS Speed Class 1
Dimension11.00 x 15.00 x 1.00 (mm)11.00 x 15.00 x 1.00 (mm)

Features

  • Dedicated power loss data protection circuitry (Data Block Recovery)
  • Refresh functions for errors prevention from Read Disturb
  • Page Mapping & Ware Leveling
  • Support Diagnosis Software “Live Monitor”
  • Fixed BOM (Main parts)
  • Failure Analysis Service
  • Supply 2D SLC through 2026

USB

Hagiwara industrial USB memory sticks allow you to save data and take logs. You can customize the cases with your logs.

 

​If you are looking for WORM Solution (Write Once Read Many Solution), Hagiwara's CDMemory2 stick & UDRW-G5 stick are the perfect fit to distribute software updates instead of optical disks.

USB 2.0

Part NumberHCF10P-RE Series (CompactFlash)HFD10P-RE SeriesMCF10P-VM Series (CompactFlash)　
NAND2D SLC2D SLC2D SLC
P/E Cycles1,00,0001,00,00050,000
Interface- PC card memory mode - PC card I/O mode - True IDE mode- PIO mode 0-4 - Multiword DMA mode 0-2 - Ultra DMA mode0-4 - ATA command set compatible- PC card memory - PC card I/O - True IDE
Capacity512MB – 64GB512MB – 64GB512MB – 8GB
Voltage3.3V / 5V3.3V / 5V3.3V / 5V
Operating TemperatureStandard Temperature: 0°C to +70°C *16/32/64GB Only, Wide Temperature: -40°C to +85°CStandard Temperature: 0°C to +70°C *16/32/64GB Only, Wide Temperature: -40°C to +85°C-40°C to +85°C
Storage Temperature-45°C to +90°C-45°C to +90°C-45°C to +90°C
Max Sequential Read/Write60 / 45 (MB/s)60 / 45 (MB/s)48 / 28 (MB/s)
Form Factor (mm)36.40 x 42.80 x 3.3036.40 x 42.80 x 3.3036.40 x 42.80 x 3.30

Features

  • Dedicated power loss data protection circuitry (Data Block Recovery)
  • Refresh functions for errors prevention from Read Disturb
  • Page Mapping & Ware Leveling
  • Support Diagnosis Software “Live Monitor”
  • Fixed BOM (Main parts)
  • Failure Analysis Service
  • Supply 2D SLC through 2026

USB 3.0

Part NumberHCF10P-RE Series (CompactFlash)HFD10P-RE SeriesMCF10P-VM Series (CompactFlash)　
NAND2D SLC2D SLC2D SLC
P/E Cycles1,00,0001,00,00050,000
Interface- PC card memory mode - PC card I/O mode - True IDE mode- PIO mode 0-4 - Multiword DMA mode 0-2 - Ultra DMA mode0-4 - ATA command set compatible- PC card memory - PC card I/O - True IDE
Capacity512MB – 64GB512MB – 64GB512MB – 8GB
Voltage3.3V / 5V3.3V / 5V3.3V / 5V
Operating TemperatureStandard Temperature: 0°C to +70°C *16/32/64GB Only, Wide Temperature: -40°C to +85°CStandard Temperature: 0°C to +70°C *16/32/64GB Only, Wide Temperature: -40°C to +85°C-40°C to +85°C
Storage Temperature-45°C to +90°C-45°C to +90°C-45°C to +90°C
Max Sequential Read/Write60 / 45 (MB/s)60 / 45 (MB/s)48 / 28 (MB/s)
Form Factor (mm)36.40 x 42.80 x 3.3036.40 x 42.80 x 3.3036.40 x 42.80 x 3.30

Features

  • Dedicated power loss data protection circuitry (Data Block Recovery)
  • Refresh functions for errors prevention from Read Disturb
  • Page Mapping & Ware Leveling
  • Support Diagnosis Software “Live Monitor”
  • Fixed BOM (Main parts)
  • Failure Analysis Service
  • Supply 2D SLC through 2026

DRAM

DDR3 Memory Module

Module TypeECCOperating ClockPinTemperatureCapacityModel Number
SO-DIMMECC1600MHz204pin0°C~85°C2GBFN12N-02GE(SE814L3
SO-DIMMECC1600MHz204pin0°C~85°C4GBFN12N-04GE(SF814L4
SO-DIMMNon ECC1600MHz204pin0°C~85°C2GBFN12N002GL-*******
SO-DIMMNon ECC1600MHz204pin0°C~85°C4GBFN12N004GL-*******
SO-DIMMNon ECC1600MHz204pin0°C~85°C8GBFN12N008GL-*******

Where * is any alphanumeric number or character for DRAM. Please contact us for details.

Module TypeECCOperating ClockPinTemperatureCapacityModel Number
SO-DIMMECC1600MHz204pin0°C~85°C2GBFN12N-02GE(SE814L3
SO-DIMMECC1600MHz204pin0°C~85°C4GBFN12N-04GE(SF814L4
SO-DIMMNon ECC1600MHz204pin0°C~85°C2GBFN12N002GL-*******
SO-DIMMNon ECC1600MHz204pin0°C~85°C4GBFN12N004GL-*******
SO-DIMMNon ECC1600MHz204pin0°C~85°C8GBFN12N008GL-*******

Where * is any alphanumeric number or character for DRAM. Please contact us for details.

DDR4 Memory Module

Model TypeECCOperating ClockPinTemperatureCapacityModel Number
SO-DIMMECC2133MHz260pin0°C~85°C4GBGN17N004GE-S5821L0
SO-DIMMECC2133MHz260pin0°C~85°C8GBGN17N008GE-S5821L0
SO-DIMMECC2133MHz260pin0°C~85°C16GBGN17N016GE-S6821L0
SO-DIMMECC2400MHz260pin0°C~85°C4GBGN19N004GE-S5821L0
SO-DIMMECC2400MHz260pin0°C~85°C8GBGN19N008GE-S5821L0
SO-DIMMECC2400MHz260pin0°C~85°C16GBGN19N016GE-S6821L0
SO-DIMMNon ECC2133MHz260pin0°C~85°C4GBGN17N004GN-*******
SO-DIMMNon ECC2133MHz260pin0°C~85°C8GBGN17N008GN-*******
SO-DIMMNon ECC2133MHz260pin0°C~85°C16GBGN17N016GN-S6821L0
SO-DIMMNon ECC2400MHz260pin0°C~85°C4GBGN19N004GN-*******
SO-DIMMNon ECC2400MHz260pin0°C~85°C8GBGN19N008GN-*******
SO-DIMMNon ECC2400MHz260pin0°C~85°C16GBGN19N016GN-S6821L0
SO-DIMMNon ECC2666MHz260pin0°C~85°C4GBGN21N004GN-*******
SO-DIMMNon ECC2666MHz260pin0°C~85°C8GBGN21N008GN-*******

Where * is any alphanumeric number or character for DRAM. Please contact us for details.

Model TypeECCOperating ClockPinTemperatureCapacityModel Number
U-DIMMECC2133MHz288pin0°C~85°C4GBGD17N004GE-S5821L0
U-DIMMECC2133MHz288pin0°C~85°C8GBGD17N008GE-S5821L0
U-DIMMECC2133MHz288pin0°C~85°C16GBGD17N016GE-S6821L0
U-DIMMECC2400MHz288pin0°C~85°C4GBGD19N004GE-S5821L0
U-DIMMECC2400MHz288pin0°C~85°C8GBGD19N008GE-S5821L0
U-DIMMECC2400MHz288pin0°C~85°C16GBGD19N016GE-S6821L0
U-DIMMNon ECC2133MHz288pin0°C~85°C4GBGD17N004GN-*******
U-DIMMNon ECC2133MHz288pin0°C~85°C8GBGD17N008GN-*******
U-DIMMNon ECC2133MHz288pin0°C~85°C16GBGD17N016GN-S6821L0
U-DIMMNon ECC2400MHz288pin0°C~85°C4GBGD19N004GN-*******
U-DIMMNon ECC2400MHz288pin0°C~85°C8GBGD19N008GN-*******
U-DIMMNon ECC2400MHz288pin0°C~85°C16GBGD19N016GN-S6821L0
U-DIMMNon ECC2666MHz288pin0°C~85°C4GBGD21N004GN-*******
U-DIMMNon ECC2666MHz288pin0°C~85°C8GBGD21N008GN-*******
U-DIMMNon ECC2666MHz288pin0°C~85°C16GBGD21N016GN-*******

Where * is any alphanumeric number or character for DRAM. Please contact us for details.

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