Winbond and Mobiveil Collaborate on Ultra-Low Power Applications

Winbond HYPERRAM™ delivers low power and low pin count, speeds graphics, and optimizes UI display refresh

Mobiveil’s HYPERRAM Controller IP enables SoC Designers to leverage Winbond’s HYPERBUS based HYPERRAM x8/x16 - 250 MHz Memory

TAICHUNG, Taiwan –2023-08-30 – Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, and Mobiveil, a fast-growing supplier of Silicon Intellectual Property (SIP), platforms, and IP-enabled design services, today announced a collaboration on a new IP controller targeting various applications such as Automotive, Smart IoT, Industrial, Wearables, TWS, Wireless Headsets, Smart Speakers, and Connectivity.

Mobiveil has adapted its HYPERRAM™ Controller to leverage the unique characteristics of Winbond's new HYPERRAM device that reaches speeds of up to 250MHz and supports densities from 32Mb to 512Mb in x8/x16 modes. Integrating Mobiveil's HYPERRAM controller to interface with Winbond's 250MHz HYPERRAM device will provide SoC designers with high performance at very low power. The ultra-low power consumption of HYPERRAM is ideal for battery-operated applications, extending standby time. The low pin count of the HYPERRAM design allows for space-saving, making it suitable for applications with space constraints. "The HYPERRAM supports HYPERBUS Interface, enabling speeds of up to 500Mbps (x8 I/O) with just 13 signal pins," said Mobiveil CEO Ravi Thummarukudy. The HYPERRAM controller provides support for AXI Memory-Mapped system interfaces, Linear/Hybrid/Wrap burst support, low power features like deep power-down and hybrid sleep mode. It also supports AMBA^® AHB-Lite system interfaces.

"Winbond's HYPERRAM is designed to enhance the IoT experience for end-users and provide a cost-effective, ultra-low power memory solution to system designers. Winbond's HYPERRAM 3.0, with a 22-pin count and an increased data transfer rate of 1000Mbps (x16 I/O), has won the 7th China IoT Innovation Awards, 2022," said Hsiang-Yun Fan, DRAM Vice President of Winbond. Winbond has positioned itself as a market leader in HYPERRAM devices and offers a complete product line of high-quality memory solutions to IoT & wearables market segments. Winbond consistently releases competitive products and provides customized memory solutions based on customers' special requirements. Winbond has shipped over 400 million HYPERRAM devices since its inception.

About Mobiveil, Inc.

Mobiveil is a fast‐growing technology company that specializes in the development of Silicon Intellectual Properties, platforms, and solutions for the networking, storage and enterprise markets. Mobiveil team leverages decades of experience in delivering high‐quality, production‐proven, high-speed serial interconnect Silicon IP cores and custom and standard form factor hardware boards to leading customers worldwide. With a highly motivated engineering team, dedicated integration support, flexible business models, strong industry presence through strategic alliances and key partnerships, Mobiveil solutions have added tremendous value to the customers in executing their product goals within budget and on time. Mobiveil is headquartered in the Silicon Valley with engineering development centers located in Milpitas, CA, Chennai, Bangalore, Hyderabad, Rajkot, India, and sales offices and representatives located in the US, Europe, Israel, Japan, Taiwan and the People’s Republic of China. For more information, please visit https://mobiveil.com.

Trademarks
All registered trademarks and other trademarks belong to their respective owners.

About Winbond

Winbond Electronics Corporation is a total memory solution provider. The Company provides customer-driven memory solutions backed by the expert capabilities of product design, R&D, manufacturing, and sales services. Winbond’s product portfolio, consisting of Specialty DRAM, Mobile DRAM, Code Storage Flash, and TrustME^® Secure Flash, is widely used by tier-1 customers in communication, consumer electronics, automotive and industrial, and computer peripheral markets. Winbond is headquartered in Central Taiwan Science Park (CTSP), and it has subsidiaries in the USA, Japan, Israel, China and Hong Kong, and Germany. Based on Taichung and Kaohsiung 12-inch fabs in Taiwan, Winbond keeps pace to develop in-house technologies to provide high-quality memory IC products.

Winbond is a registered trademark of Winbond Electronics Corporation. All other trademarks and copyrights mentioned herein are the property of their respective owners.