Microphone-Array Bluetooth Conference Speaker

 

Application

  • PC and mobile phones can be connected via Bluetooth or USB
  • Supports Bluetooth 4.2 and can be easily upgraded to Bluetooth 5.0
  • Supports various meeting client software such as Skype, Webex, Zoom, and Tencent Meeting
  • Battery-powered, portable
  • Supports far-field voice pickup, with a pickup distance of over 5 meters
  • Can clearly pick up sound even in slightly noisy environments or rooms with significant echo

DSP Software and Algorithm Design

  • Utilizes XMOS audio DSP processing technology
  • Beamformer: Enhances voice pickup within the beam while suppressing noise outside the beam
  • AEC: Echo cancellation algorithm, mono 16Khz sampling rate, echo suppression ratio reaches 70dB+, Tail Length: 400ms
  • DOA: Real-time localization of the speaker's sound source position and angle, accuracy ±5 degrees
  • NS: Noise reduction algorithm, capable of suppressing both steady-state and non-steady-state noise, with a suppression ratio of up to 20dB
  • AGC: Automatic gain control, high dynamic range, flexible and adjustable
  • All the above algorithms provide numerous parameter interfaces for user fine-tuning
  • Additionally, offers rich EQ and DRC optional algorithms for correcting the frequency response curves of microphones and speakers

Class D Amplifier

  • Uses Infineon's latest Class D technology
  • Utilizes 5-level PWM modulation technology in BTL configuration
  • Multi-Level modulation technology combines high modulation ratio, lower MOS conduction voltage, lower MOS losses, and filter-less technology
  • Infineon's Class D offers high efficiency, ultra-low power consumption, and heat generation, while providing higher THD+N and signal-to-noise ratio
  • Suitable for applications requiring long battery life and high sound quality

Bluetooth Module

  • Utilizes Microchip Bluetooth technology
  • Supports HCI interface stand-alone dual-mode Bluetooth module
  • Supports traditional Bluetooth and BLE 4.2 Bluetooth protocol
  • Supports HFP 1.6, HSP 1.2, A2DP 1.3, SPP 1.2, AVRCP 1.6
  • Supports high-definition digital IIS audio up to 96KHz/24bit
  • Supports SBC and AAC decoding
  • Built-in 20-bit DAC with a signal-to-noise ratio of up to 96dB
  • Built-in 16-bit ADC with a signal-to-noise ratio of up to 90dB
  • BLE part can cooperate with Microchip MBA APP for command control, pairing control, and Bluetooth module power on/off control

Communication Interface

  • USB Connection
  • Direct support for USB 1.0 interface, driver-free on Windows, MAC, and Android.
  • Supports UAC 1.0 protocol, also supports HID protocol for communication with touch buttons.
  • Supports USB DFU protocol for easy software upgrades.
  • Bluetooth 4.2 Connection:
  • Through the Bluetooth module, easily supports Bluetooth 4.2 connection.
  • Supports Bluetooth profiles such as A2DP 1.3, HFP 1.6, HSP 1.2, AVRCP 1.6, SPP 1.2.
  • The Bluetooth module has a built-in HiFi-grade CODEC, with audio resolution up to 24bit/96Khz.
  • In this solution, it not only meets the high audio quality requirements for conference calls but also ensures high-quality music enjoyment for users during entertainment use.

Touch Control

  • Implements functions such as volume increase and decrease, pick up and hang up, Bluetooth and USB mode selection buttons, etc.
  • Supports 8-way touch; in standby mode, 8-channel scanning takes only 70ms, with a power consumption of 120uA
  • In deep sleep mode, the operating current is nearly 5uA

Block Diagram

Main Chip:

  • Microchip PCI18F26K40 (MCU)
  • Microchip BM64 (BT Module)
  • Microchip CAP1296 (Touch Sensor)
  • Infineon MA12040 / MA12070 (Merus Class D Audio)